BondCheck

For price, contact us by Phone: (+45) 44 65 22 77 or Email: info@ndtvendor.com


 



 

BondCheck from Baugh&Weedon

 

The new BondCheck is a multi-mode bond-testing flaw detector that delivers rapid bond inspection in pitch-catch or resonance modes, or Mechanical Impedance Analysis (MIA), with outstanding defect sensitivity.

 

Typical inspection applications include carbon-fibre and metallic honeycomb structures that must be examined for delaminations, disbonds and core damage, as well as detection of small flaws and dry coupling. BondCheck is ideal for the broad spectrum of advanced-materials NDT demanded in the aerospace, automotive, wind-energy and advanced-manufacturing sectors.

 

Advantages of BondCheck include:

  • Choice of probe types available for different inspections
  • Flip function for left- or right-handed users

 


 

Overview

Housed in a lightweight instrument (1.2 kg) with a common user interface across the three modes, BondCheck offers simple, intuitive operator-driven set-up. The large daylight-readable screen gives the operator excellent data presentation and signal resolution. Users can configure colour schemes and employ a secondary panel to create a split screen with X-Y spot, frequency sweep, RF waveform or spectrum views—making BondCheck a versatile asset for laboratory or field inspection.

 

The BondCheck Pitch-Catch probe delivers high performance and durability. Ergonomic design provides robust, comfortable operation. Probe foot position can be adjusted by the operator to suit the task, and the hard-wearing probe tips are interchangeable; both rounded and flat tip profiles are available. The probe is broadband and suitable for a wide variety of applications.

 

BondCheck Resonance probes are offered in a range of frequencies (80, 100, 160, 200, 250 and 350 kHz) and can also be supplied as a multi-probe kit. Both probe types include an alarm LED and digital ID for ease of use; settings can be stored, and “air calibration” is possible to establish the most sensitive inspection frequencies.

 

The MIA technique is particularly valuable for detecting small defects, using a dry-coupled probe with a small contact area. It offers excellent near-surface defect sensitivity and is especially suitable for detecting skin-to-core disbonds in composite and metallic honeycomb structures.

 


 

Features

 

  • Multi-mode bond-testing instrument
  • Unique calibration function for quick, easy set-up
  • Lightweight and portable
  • Dry-coupled pitch-catch and MIA probes
  • Automatic test-frequency optimisation
  • Ideal for inspection of metallic bonded structures, composites and metallic honeycombs
  • 3-year warranty


Specifications

Display Type 5.7 in (145 mm), 18-bit colour, daylight readable
  Viewable Area 115.2 mm (H) × 86.4 mm (V), resolution 640 × 480 pixels
  Colour Schemes User-configurable: Dark, Bright and Black & White
  Configurable Screen Full Screen, Single, Dual Pane with variable size, location and function (e.g. X-Y, Timebase)
  Display Modes Pitch-Catch, Resonance & MIA: Spot and Sweep; RF Timebase for Pitch-Catch only
  Graticules None; Grid (4 sizes 5, 10, 15, 20 % FSH); Polar (4 sizes 5, 10, 15, 20 % FSH)
  Offset Spot position Y -50 to +50 %, X -65 to +65 %
  Flip Manual or automatic screen rotation for left- or right-handed use
Transmit Operating Mode Pitch-Catch / MIA tone burst
  Output Frequency Range Pitch-Catch: 5 kHz – 50 kHz
Resonance: 50 kHz – 500 kHz
MIA: 2 kHz – 10 kHz
  Output Voltage Pitch-Catch tone burst: 10 ranges 1, 3, 6, 8, 10, 12, 18, 24, 30, 36 V pk-pk
Pitch-Catch sweep: 3 ranges 12, 24, 36 V pk-pk
Resonance: 3 ranges 12, 24, 36 V pk-pk
MIA: 3 ranges 12, 24, 36 V pk-pk (high-voltage drive in probe)
  Minimum Output-Drive Load Impedance 300 Ω
  Waveform Type: Pitch-Catch / MIA Tone burst with rectangular or Hanning window plus chirp
Max transmit-waveform points 8 192
Waveform duration max 3.2 ms / 2.5 ms
DAC clock rate 2.5 MHz fixed
Frequency sweep 5 kHz – 50 kHz / 2 kHz – 10 kHz
  Waveform Type: Resonance Fixed or swept waveform
Frequency range 5 kHz – 500 kHz
Receive Pitch-Catch / MIA Tone Burst Sample rate 440 kHz / 100 kHz
Max PRF 14 Hz
Sample bit depth 12-bit
Gain range 0 – 60 dB
Receive bandwidth 5 kHz – 100 kHz (-6 dB)
Input-voltage saturation ±400 mV
Time-base range 100 µs – 2 ms / 22 ms
Time-base delay 0 µs – 1 ms
Crosstalk > 40 dB isolation
Amplitude/phase extraction cursor resolution <5 µs / 10 µs
  Resonance & Pitch-Catch Sweep Dynamic range > 150 dB
Bit depth 24-bit
Gain range -30 – 60 dB
Receive bandwidth DC – 20 MHz
Amplitude/phase extraction via QAM demodulation
  Filtering Fixed hardware high-pass filter (Pitch-Catch) to reduce surface-scanning noise
Fixed hardware low-pass filter 100 kHz (Pitch-Catch) for optimum amplifier SNR
Configurable software high-/low-pass filters for all modes
Software Acquisition Gate in RF Mode Adjustable gate start, width and threshold
  Alarm Gate in Y-T Mode Multiple box, circle and sector alarm zones
  Calibration Mode Frequency sweep of bonded and disbonded areas; automatic inspection-frequency selection with manual adjustment; air calibration in resonance mode
  Bond/Disbond Alarm Status on screen and probe LED
Removable Data Storage Setup Storage microSD up to 32 GB, > 10 000 setups
  Stored Screen Shots microSD up to 32 GB, > 10 000 screenshots
  Record Replay Real-time trace recording; replay on instrument or PC up to 164 s
Physical Weight 1.2 kg (2.7 lb)
  Size (W × H × D) 237.5 mm × 144 mm × 52 mm (9.4 in × 5.7 in × 2.1 in)
  Material/Housing Magnesium-silicon (Mg Si 0.5) aluminium alloy, powder-coated
  Operating / Storage Temperature Operation -20 °C to +60 °C
Storage -20 °C to +60 °C (up to 12 months); nominal +20 °C
  IP Rating IP 54
Warranty 3-year manufacturer’s warranty Covers all BondCheck components; excludes customer damage or misuse (probes not included)
Title Type Size Download
BondCheck_brochure.pdf PDF 1.40MB Download
EM004-Rev-01-BondCheck-Manaul.pdf PDF 8.07MB Download