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The new BondCheck is a multi-mode bond-testing flaw detector that delivers rapid bond inspection in pitch-catch or resonance modes, or Mechanical Impedance Analysis (MIA), with outstanding defect sensitivity.
Typical inspection applications include carbon-fibre and metallic honeycomb structures that must be examined for delaminations, disbonds and core damage, as well as detection of small flaws and dry coupling. BondCheck is ideal for the broad spectrum of advanced-materials NDT demanded in the aerospace, automotive, wind-energy and advanced-manufacturing sectors.
Advantages of BondCheck include:
Housed in a lightweight instrument (1.2 kg) with a common user interface across the three modes, BondCheck offers simple, intuitive operator-driven set-up. The large daylight-readable screen gives the operator excellent data presentation and signal resolution. Users can configure colour schemes and employ a secondary panel to create a split screen with X-Y spot, frequency sweep, RF waveform or spectrum views—making BondCheck a versatile asset for laboratory or field inspection.
The BondCheck Pitch-Catch probe delivers high performance and durability. Ergonomic design provides robust, comfortable operation. Probe foot position can be adjusted by the operator to suit the task, and the hard-wearing probe tips are interchangeable; both rounded and flat tip profiles are available. The probe is broadband and suitable for a wide variety of applications.
BondCheck Resonance probes are offered in a range of frequencies (80, 100, 160, 200, 250 and 350 kHz) and can also be supplied as a multi-probe kit. Both probe types include an alarm LED and digital ID for ease of use; settings can be stored, and “air calibration” is possible to establish the most sensitive inspection frequencies.
The MIA technique is particularly valuable for detecting small defects, using a dry-coupled probe with a small contact area. It offers excellent near-surface defect sensitivity and is especially suitable for detecting skin-to-core disbonds in composite and metallic honeycomb structures.
| Display | Type | 5.7 in (145 mm), 18-bit colour, daylight readable |
|---|---|---|
| Viewable Area | 115.2 mm (H) × 86.4 mm (V), resolution 640 × 480 pixels | |
| Colour Schemes | User-configurable: Dark, Bright and Black & White | |
| Configurable Screen | Full Screen, Single, Dual Pane with variable size, location and function (e.g. X-Y, Timebase) | |
| Display Modes | Pitch-Catch, Resonance & MIA: Spot and Sweep; RF Timebase for Pitch-Catch only | |
| Graticules | None; Grid (4 sizes 5, 10, 15, 20 % FSH); Polar (4 sizes 5, 10, 15, 20 % FSH) | |
| Offset | Spot position Y -50 to +50 %, X -65 to +65 % | |
| Flip | Manual or automatic screen rotation for left- or right-handed use | |
| Transmit | Operating Mode | Pitch-Catch / MIA tone burst |
| Output Frequency Range | Pitch-Catch: 5 kHz – 50 kHz Resonance: 50 kHz – 500 kHz MIA: 2 kHz – 10 kHz |
|
| Output Voltage | Pitch-Catch tone burst: 10 ranges 1, 3, 6, 8, 10, 12, 18, 24, 30, 36 V pk-pk Pitch-Catch sweep: 3 ranges 12, 24, 36 V pk-pk Resonance: 3 ranges 12, 24, 36 V pk-pk MIA: 3 ranges 12, 24, 36 V pk-pk (high-voltage drive in probe) |
|
| Minimum Output-Drive Load Impedance | 300 Ω | |
| Waveform Type: Pitch-Catch / MIA | Tone burst with rectangular or Hanning window plus chirp Max transmit-waveform points 8 192 Waveform duration max 3.2 ms / 2.5 ms DAC clock rate 2.5 MHz fixed Frequency sweep 5 kHz – 50 kHz / 2 kHz – 10 kHz |
|
| Waveform Type: Resonance | Fixed or swept waveform Frequency range 5 kHz – 500 kHz |
|
| Receive | Pitch-Catch / MIA Tone Burst | Sample rate 440 kHz / 100 kHz Max PRF 14 Hz Sample bit depth 12-bit Gain range 0 – 60 dB Receive bandwidth 5 kHz – 100 kHz (-6 dB) Input-voltage saturation ±400 mV Time-base range 100 µs – 2 ms / 22 ms Time-base delay 0 µs – 1 ms Crosstalk > 40 dB isolation Amplitude/phase extraction cursor resolution <5 µs / 10 µs |
| Resonance & Pitch-Catch Sweep | Dynamic range > 150 dB Bit depth 24-bit Gain range -30 – 60 dB Receive bandwidth DC – 20 MHz Amplitude/phase extraction via QAM demodulation |
|
| Filtering | Fixed hardware high-pass filter (Pitch-Catch) to reduce surface-scanning noise Fixed hardware low-pass filter 100 kHz (Pitch-Catch) for optimum amplifier SNR Configurable software high-/low-pass filters for all modes |
|
| Software | Acquisition Gate in RF Mode | Adjustable gate start, width and threshold |
| Alarm Gate in Y-T Mode | Multiple box, circle and sector alarm zones | |
| Calibration Mode | Frequency sweep of bonded and disbonded areas; automatic inspection-frequency selection with manual adjustment; air calibration in resonance mode | |
| Bond/Disbond Alarm | Status on screen and probe LED | |
| Removable Data Storage | Setup Storage | microSD up to 32 GB, > 10 000 setups |
| Stored Screen Shots | microSD up to 32 GB, > 10 000 screenshots | |
| Record Replay | Real-time trace recording; replay on instrument or PC up to 164 s | |
| Physical | Weight | 1.2 kg (2.7 lb) |
| Size (W × H × D) | 237.5 mm × 144 mm × 52 mm (9.4 in × 5.7 in × 2.1 in) | |
| Material/Housing | Magnesium-silicon (Mg Si 0.5) aluminium alloy, powder-coated | |
| Operating / Storage Temperature | Operation -20 °C to +60 °C Storage -20 °C to +60 °C (up to 12 months); nominal +20 °C |
|
| IP Rating | IP 54 | |
| Warranty | 3-year manufacturer’s warranty | Covers all BondCheck components; excludes customer damage or misuse (probes not included) |
| Title | Type | Size | Download |
|---|---|---|---|
| BondCheck_brochure.pdf | 1.40MB | Download | |
| EM004-Rev-01-BondCheck-Manaul.pdf | 8.07MB | Download |
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